Immersion Cooling System
Neurair’s Immersion Cooling system submerges entire server components in dielectric fluid for maximal thermal transfer and energy savings. Designed for ultra-high-density compute and GPU clusters, it enables silent, fanless operation while dramatically reducing HVAC and facility cooling demand.
Advantages
Total Server Heat Absorption
Immersion cooling submerges components in dielectric fluid, capturing heat from every part of the system—CPU, GPU, memory, and power modules.
Zero Fan, Zero Noise Operation
With all internal server fans removed, systems run silently with no vibration or mechanical wear, ideal for sensitive or edge environments.
Extreme Efficiency & Space Savings
Dramatically reduces energy use by eliminating air cooling. Enables higher compute density within a smaller footprint while lowering OPEX.
Why We Need Immersion
As AI workloads intensify and rack densities exceed traditional thermal limits, immersion cooling offers a future-ready alternative. By fully submerging servers in dielectric fluid, heat is captured directly at the component level—maximizing cooling efficiency and eliminating the need for fans or airflow.
It’s a game-changing solution for AI clusters, GPU farms, and edge deployments, delivering unmatched thermal performance with minimal maintenance. Plus, it supports ESG goals through reduced energy consumption and carbon impact.
Component-Level Cooling
Silent, Maintenance-Free Operation
Immersion captures heat across all server parts—not just CPUs—improving thermal uniformity and reliability.
No moving parts. No dust. No fan failures. Just clean, efficient cooling trusted in hyperscale trials and edge rollouts.
How it works?
Complete Thermal Contact
Servers are fully submerged in dielectric fluid, allowing direct and uniform heat absorption from all components.
No Airflow Required
Immersion eliminates the need for fans or air movement, reducing energy use and noise while increasing reliability.
Circulating Heat to CDU
The heated fluid is pumped through a CDU or heat exchanger loop, where heat is rejected into the facility water loop.
High-Density Performance
Supports workloads above 100 kW/rack, ideal for GPUs, ASICs, and liquid-cooled chip designs.
Scalable and Contained
Compact tanks support modular deployment in new or existing white space.